Product Range

1)  CEM-1, CEM-3, FR4, FR2, HB
2)  High Frequency Circuit Materials : Arlon, Rogers
3)  Halogen –Free Material

Laminate Thickness

0.4 ~ 2.4mm  2 double sided to 10-layered

Cu Foil Thickness

18mil to 70mil (0.5oz ~ 2oz)

Minimum Finished Hole

0.1mm (4 mil)

Minimum Line Width

0.07mm (3 mil)

Minimum Air Gap

0.07mm (3 mil)

Fine SMD Pitch

0.20mm (8 mil)

Maximum Panel Size

457mm x 609mm (18”x24”)

Metal Surface Finishing

1)  Electroless Ni / Au Plating    
2)  Soft/Hard Au Plating
3)  Carbon Ink / Silver Ink
4)  Pre-Flux    
5)  Entek   
6)  Lead-Free Hot Air Levelling     
7)  Immersion Gold

Solder-mask Finishing

1)  Wet Film
2)  Thermal Cure Solder-mask
3)  UV Solder-mark
4)  Peelable Solder-mask

Profile

1)  CNC Routing
2)  V-Cut
3)  Mould-Die Punching

RoHs Standard

Passed with SGS Sample Approved